Method of forming wire overmold device

ABSTRACT

A wire overmold device including a carrier body having a distal end and a proximal end, a wire cap configured to engage the distal end of the carrier body, at least one of a jacketed cable and one or more wires at least partially enclosed between the wire cap and the carrier body, and an overmold formed over the proximal end of the carrier body and at least portions of the wire cap and the distal end of the carrier body, wherein the wire cap and the distal end of the carrier body protrude from the overmold.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of, and claims the benefit of priorityto, U.S. patent application Ser. No. 15/474,013, filed Mar. 30, 2017,now U.S. Pat. No. 9,935,499, entitled “Wire Overmold Device and Methodof Forming Wire Overmold Device,” which application is incorporatedherein by reference in its entirety.

FIELD OF THE DISCLOSURE

Embodiments of the present disclosure relate generally to the field ofelectrical conductors, and more particularly to wire overmold devices.

BACKGROUND OF THE DISCLOSURE

Sensors, electronics, and wire connectors used in automotiveapplications are commonly housed in protective enclosures to protectsuch components from debris, fluids, and extreme temperatures present inautomotive environments. A sensor may be connected to one or moreinsulated conductor wires or jacketed cable, which extend a desiredlength beyond a protective enclosure for connection to other components.The sensor and at least a portion of the extending wires may beencapsulated in epoxy or thermoset to seal and protect the wires.However, use of an epoxy or thermoset does not allow for an efficientway to locate and position the wires or jacketed cable in a desiredmanner during encapsulation. This may result in wires not being properlypositioned once the thermoset or epoxy sets, which may lead to damage orpremature failure.

The sensor and at least a portion of the wires extending therefrom mayalternatively be enclosed in an overmold, which may protect the sensorand associated electronic components and allow for a generally morereliable positioning of the wires relative to the sensor and associatedelectronic components. The connecting wires may extend out of theovermold for connection to other automotive components. However, whenthe wires are not securely held in a desired position at an end of theovermold, during the molding operation one or more of the wires mayshift and become caught in the mold enclosure during the operation.Thus, when the mold is closed, a portion of the wires extending out ofthe overmold may be crimped and insulation on the wires or jacketedcable may be damaged, potentially resulting in an electrical leak pathor fluid leak path and rendering some or all of the overmoldedcomponents useless.

Additionally, if the extending wires cannot be reliably held in adesired position and orientation during overmolding, the number ofpossible configurations and arrangements of the extending wires isseverely limited. This may result in design constraints that increasemanufacturing cost and time.

It is with respect to these and other considerations that the presentimprovements may be useful.

SUMMARY

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended asan aid in determining the scope of the claimed subject matter.

An exemplary embodiment of the present invention is a wire overmolddevice comprising a carrier body having a distal end and a proximal endand a wire cap configured to engage with at least a distal portion ofthe carrier body. At least one of a jacketed cable and one or more wiresis at least partially enclosed between the wire cap and the carrierbody. An overmold formed over the proximal end of the carrier body andat least portions of the wire cap and the distal end of the carrierbody. The wire cap and the distal end of the carrier body protrude fromthe overmold.

An exemplary embodiment of the present invention is a method for forminga wire overmold device comprising inserting one or more electroniccomponents and at least one of a jacketed cable and one or more wires ina carrier body, the carrier body having a distal end and a proximal end.The method further includes at least partially enclosing the at leastone of a jacketed cable and one or more wires between a wire cap and thecarrier body, and forming an overmold over the proximal end of thecarrier body and at least portions of the wire cap and the distal end ofthe carrier body. The wire cap and the distal end of the carrier bodyprotrude from the overmold.

BRIEF DESCRIPTION OF THE DRAWINGS

By way of example, specific embodiments of the disclosed device will nowbe described, with reference to the accompanying drawings, in which:

FIGS. 1A and 1B are perspective views illustrating an exemplaryembodiment of a wire overmold device in accordance with the presentdisclosure;

FIG. 2 is a view in section illustrating the wire overmold device shownin FIGS. 1A and 1B;

FIGS. 3A-3D are a plurality of side and perspective views illustratingan embodiment of a carrier body of the wire overmold device shown inFIGS. 1A and 1B;

FIGS. 4A-4C are a plurality of side and perspective views illustratingan embodiment of a wire cap of the wire overmold device shown in FIGS.1A and 1B;

FIGS. 5A-5I are a series of views illustrating a method of formingassociated with an embodiment of a wire overmold device in accordancewith the present disclosure.

DETAILED DESCRIPTION

A wire overmold device in accordance with the present disclosure willnow be described more fully hereinafter with reference to theaccompanying drawings, in which certain exemplary embodiments of thewire overmold device are presented. The wire overmold device may beembodied in many different forms and is not to be construed as beinglimited to the embodiments set forth herein. These embodiments areprovided so that this disclosure will be thorough and complete, and willconvey certain exemplary aspects of the wire overmold device to thoseskilled in the art. In the drawings, like numbers refer to like elementsthroughout unless otherwise noted.

FIGS. 1A and 1B show perspective views of a wire overmold device 100 inaccordance with an exemplary embodiment of the present disclosure. Thewire overmold device 100 may include a carrier body 105 at leastpartially enclosed in an overmold 110. The carrier body 105 may beenclosed by the overmold 110 at a proximal end 115 a and may extendbeyond the overmold 110 at a distal end 115 b. As will be describedbelow, a wire cap 120 may be removably coupled to the carrier body 105at the distal end 115 b for securing the relative position of one ormore wires or jacketed cable 125 a, 125 b extending out of the distalend 115 b. FIG. 2 is a view in section of the wire overmold device 100illustrating wires 125 a, 125 b inserted in the carrier body 105 andenclosed at the proximal end 115 a. The wires 125 a, 125 b extend to thedistal end 115 b beyond the overmold 110, the carrier body 105, and thewire cap 120.

An exemplary embodiment of the carrier body 105 is illustrated in FIGS.3A-3D. The carrier body 105 may include an elongated semi-cylindricalbody 305 extending in a direction along axis 310. The semi-cylindricalbody 305 may have a curved outer surface 315 and a top surface portion320, the top surface portion 320 extending in a direction substantiallyparallel to the axis 310. It should be understood that the carrier body105 may be any size and shape adapted to the desired application. Thecarrier body 105 may be made from a variety of materials, including butnot limited to, plastic, composite, or the like.

The top surface portion 320 may include a plurality of cavities 325, 330a, 330 b, extending into the semi-cylindrical body 305, for receivingand retaining a sensor, electronic components (not shown), and wires 125a, 125 b (see FIGS. 1A-2). The cavity 325 may be disposed at theproximal end 115 a and may be configured to at least partially receiveand retain a sensor, e.g., a Hall sensor, and/or other electroniccomponents (not shown). The cavity 325 may be any size and shape adaptedto receive and retain electronic components necessary for a desiredapplication (see FIG. 5A). For example, the electronic components may bea slip fit into the cavity 325 so that a clearance is maintained toprotect the electronic components from forces applied to the carrierbody 105. A snug, or snap fit may allow the cavity 325 to securelyretain the electronic components during assembly and molding processesto minimize displacement and potential damage.

Cavities 330 a, 330 b may be adjacent the cavity 325 and may extend in adirection along the axis 310 toward the distal end 115 b of the carrierbody 105. The cavities 330 a, 330 b may extend substantially parallel toeach other, and a dividing wall 335 may extend between the cavities 330a, 330 b to maintain a separation of the wires 125 a, 125 b. Thecavities 330 a, 330 b may have semicircular cross-sections and may beadapted to conformingly receive the respective wires 125 a, 125 b.Similar to the cavity 325, the wires 125 a, 125 b may be a snug or snapfit within the cavities 330 a, 330 b. A snug or snap fit clearanceallows the wires 125 a, 125 b to be at least partially received in therespective cavities 330 a, 330 b of the carrier body 105 while providingeasy assembly and protection from forces applied to the carrier body105. For example, the carrier body 105 may experience forces appliedduring a molding process. The cavities 330 a, 330 b should therefore besized and shaped to accordingly accommodate wires 125 a, 125 b for thedesired application. In some embodiments, at least first portions 340 a,340 b of the respective cavities 330 a, 330 b may extend substantiallyparallel to the top surface portion 320 along the axis 310, while atleast second portions 345 a, 345 b may be angled to extend inward to thesemi-cylindrical body 305 from the top surface portion 320 (see alsoFIG. 2). FIG. 2 shows an angled portion 205 of the wire 125 a extendinga distance d measured in a direction perpendicular to the axis 310 andthe top surface portion 320. The angled portion 205 may be disposedbetween two substantially straight portions 210, 215 of the wire 125 a.

As illustrated in FIGS. 3A-3C, the first portions 340 a, 340 b aredisposed toward the proximal end 115 a of the carrier body 105, and thesecond portions 345 a, 345 b are disposed toward the distal end 115 b ofthe carrier body 105. In some embodiments, at least third portions 350a, 350 b of the respective cavities 330 a, 330 b may be disposed at thedistal end 115 b of the carrier body 105, so that the second portions345 a, 345 b are disposed between the first portions 340 a, 340 b andthe third portions 350 a, 350 b. The third portions 350 a, 350 b mayextend substantially parallel to the top surface 320 along the axis 310,for example, at the distance d from the first portions 340 a, 340 b.

Referring now to FIG. 3D, a detailed view illustrating the distal end115 b of the carrier body 105 is shown. The carrier body 105 may includea distal portion 355. The third portion 350 a, 350 b of the respectivecavities 330 a, 330 b may be disposed in the distal portion 355,extending along the direction of the axis 310. The wires 125 a, 125 bmay be disposed in the respective cavities 330 a, 330 b, connected tothe sensor or electronic components disposed in the cavity 325 at theproximal end 115 a of the carrier body 105 and protrude from the distalportion 355 at the distal end 115 b. For example, the wires 125 a, 125 bmay extend beyond end face 365 of the distal portion 355. The cavities330 a, 330 b each end at the end face 365 of the distal portion 355. Itis advantageous to form a rounded edge 370 a, 370 b at the respectiveends of the cavities 330 a, 330 b in the end face 365 to prevent wire orjacketed cable damage such as scratching or the like (see also FIG. 5E).In other embodiments, a chamfer or scallop cut may be formed at therespective ends of the cavities 330 a, 330 b at the end face 365.

The dividing wall 335 may be disposed between the cavities 330 a, 330 band may extend in a direction along the axis 310. In some embodiments,the dividing wall may include a recess 360. As will be described belowwith respect to FIG. 5C, the recess 360 may receive at least a portionof the wire cap 120 to couple the carrier body 105 and the wire cap 120together.

Detailed views illustrating the wire cap 120 are illustrated in FIGS.4A-4C. The wire cap 120 may be an elongated semi-cylindrical body 405extending along the axis 310 and may have a curved outer surface 415 anda top surface portion 420. The top surface portion 420 may extend in adirection substantially parallel to the axis 310. The wire cap 120 maybe made from a variety of materials, including, but not limited to,plastic, composite, or the like. In embodiments, the wire cap 120 may bemade of the same or different material from the carrier body 105. Thewire cap 120 may be configured to couple to the carrier body 105 at thedistal portion 355, with the top surface portion 320 of the carrier body105 mating with the top surface portion 420 of the wire cap 120.

Cavities 430 a, 430 b may be formed in the top surface portion 420 andmay extend into the semi-cylindrical body 405 in a direction parallel tothe axis 310. The cavities 430 a, 430 b may be configured to at leastpartially receive and retain the wires 125 a, 125 b (see FIGS. 1A-2). Asdescribed above with respect to the carrier body 105, the cavities 430a, 430 b should be sized and shaped to accommodate the wires 125 a, 125b for a desired application, and should conform with the third portion350 a, 350 b of the cavities 330 a, 330 b in the distal portion 355 ofthe carrier body 105.

The cavities 430 a, 430 b may extend the entire length L of the wire cap120, extending from end face 460 to end face 465 of the wire cap 120. Itis advantageous to form a rounded edge 470 a, 470 b at the respectiveends of the cavities 430 a, 430 b in the end face 465 to prevent wire orjacketed cable damage such as may result from scratching or the like(see also FIG. 5E). In other embodiments, a chamfer or scallop cut maybe formed at the respective ends of the cavities 430 a, 430 b at the endface 465. When attached, the end face 365 of the distal portion 355 ofthe carrier body 105 is coplanar with the end face 465 of the wire cap120.

A protrusion 425 may be disposed between the cavities 430 a, 430 b forengagement with the recess 360 of the carrier body 105 (see FIG. 3D) tocouple the wire cap 120 and the carrier body 105. The protrusion 425 andthe corresponding recess 360 may be cylindrical, rectangular, irregular,etc. and may be adapted to mate with one another. It is understood,however, that the protrusion 425, and corresponding recess 360, may bedesigned to engage one another in a single orientation (i.e., a“mistake-proof” fit) to decrease assembly time. In other embodiments,the protrusion 425 and corresponding recess 360 may be adapted to allowmating engagement in more than one orientation. The protrusion 425 mayextend in a direction opposite the semi-cylindrical body 415 andsubstantially perpendicular to the top surface portion 420 to engagewith the recess 360 in the distal portion 355 of the carrier body 105.

In some embodiments, a groove 440 may be formed on the curved outersurface 415 opposite the top surface portion 420. As will be describedbelow, the groove 440 may be advantageous for facilitating alignment andretention in the overmold 110. In some embodiments, a plurality ofgrooves may be formed on the curved outer surface 415 (see FIG. 5I), butthis is not critical. The groove 440 may extend in a directionsubstantially perpendicular to the axis 310, thereby limiting axialmovement of the wire cap 120 along the axis 310 with respect to thecarrier body 105.

Referring now to FIGS. 5A-5I, an exemplary embodiment of a wire overmolddevice and molding process in accordance with the present disclosure areshown. A carrier body 105 may be configured to receive wires 125 a, 125b and electronic components 500. The electronic components 505 mayinclude a sensor, e.g., a Hall sensor. As described above, theelectronic components 505 may be received in cavity 325 at a proximalend 115 a of the carrier body 105. The wires 125 a, 125 b may each beconnected to the electronic components 505 in any known manner, with thewires 125 a, 125 b extending in a direction along axis 310 toward adistal end 115 a of the carrier body 105 in cavities 330 a, 330 b. Thewires 125 a, 125 b extend to a distal portion 355 of the carrier body105, and beyond an end face 365 of the distal portion 355.

As shown in FIG. 5B, one or more ribs 505 a, 505 b . . . 505 n mayprotrude into each of the cavities 330 a, 330 b. The ribs 505 a, 505 b .. . 505 n may extend from side walls 510 a, 510 b, 515 a, 515 b in adirection substantially perpendicular to the longitudinal axes of thecavities 330 a, 330 b. The ribs 505 a, 505 b . . . 505 n are configuredto secure the wires 125 a, 125 b within the respective cavities 330 a,330 b. Thus, when disposed in the respective cavities 330 a, 330 b, thewires 125 a, 125 b are securely retained and positioned ribs 505 a, 505b . . . 505 n in a consistent and repeatable manner, thereby eliminatingunwanted shifting or movement and preventing potential damage duringmolding processes.

When the wires 125 a, 125 b are securely positioned in the carrier body105, a wire cap 120 may be coupled to the carrier body 105, as shown inFIGS. 5C-5F. At least a third portion 350 a, 350 b of the cavities 330a, 330 b of the distal portion 355 of the wire body 105 mate with therespective cavities 430 a, 430 b of the wire cap 120. As shown, when thewire cap 120 is coupled to the distal portion 355 of the carrier body105, at least a portion of the wires 125 a, 125 b are enclosed and fixedin position, which is maintained throughout a molding process. The wirecap 120 is coupled to the distal portion 355 of the carrier body 105 byprotrusion 425, which is configured to be received within recess 360 ofthe carrier body 105.

When assembled, the top surface portion 320 of the carrier body 105 ismated with the top surface portion 420 of the wire cap 120. In someembodiments, third portions 350 a, 350 b of cavities 330 a, 330 b aresubstantially equal in size and shape to the cavities 430 a, 430 b ofthe wire cap 120, so that the wires 125 a, 125 b are equally enclosed bythe distal portion 355 of the carrier body 105 and the wire cap 125. Inother embodiments, the third portions 350 a, 350 b of the cavities 330a, 330 b enclose a greater portion of wires 125 a, 125 b than thecavities 430 a, 430 b of the wire cap 120 (see FIG. 5F). As shown inFIG. 5F, the third portions 350 a, 350 b of the cavities 330 a, 330 bsurround a greater circumference of the wires 125 a, 125 b than thecavities 430 a, 430 b. In these embodiments, it may be advantageous toassemble the wires 125 a, 125 b in the larger third portions 350 a, 350b of the cavities 330 a, 330 b, so that the wires 125 a, 125 b are heldin position until the wire cap 120 is attached to the carrier body 105.

End face 455 of the wire cap 120 may abut a ledge 380 of the distalportion 355 of the carrier body 105, and end face 465 of the wire cap120 may be aligned and coplanar with the end face 365 of the distalportion 355 of the carrier body 105. As shown in FIGS. 5D-5F, at least aportion of the curved surface portion 315 of the carrier body 105 has acurvature substantially similar to the curved surface portion 415 of thewire cap 120. When assembled, at least a portion of the semi-cylindricalbody 305 of the distal portion 355 of the carrier body 105, and thesemi-cylindrical body 405 of the wire cap 120 may form a substantiallyuniform cylindrical portion 520, thereby improving a molding process.The assembled carrier body 105, wire cap 120, wires 125 a, 125 b, andelectronic components 505 form a sub-assembly 525.

Referring now to FIGS. 5G and 5I, the sub-assembly 525 is positionedwith respect to a bushing 530 in a mold for a molding process. Themolding process forms an overmold 110 over the sub-assembly 525 andbushing 530, thereby forming the wire overmold device 100. The overmold110 connects the sub-assembly 525 with the bushing 530, whichfacilitates connection to automotive components, e.g., a transmission.The overmold 110 may be formed of plastic, composite, or similarmaterial.

As shown, the overmold 110 includes a substantially cylindrical portion530 enclosing at least a portion of the wire cap 120 and at least aportion of the distal portion 355 of the carrier body 105. To protectthe wires 125 a, 125 b extending out the distal end 115 a of the wireovermold device 100, at least a portion of the wire cap 120 and thedistal portion 355 of the carrier body 105 extend beyond an end 535 ofthe cylindrical portion 530 of the overmold 110. When the overmold 110does not extend beyond the wire cap 120 and the distal portion 355 ofthe carrier body 105, a desired position of the wires 125 a, 125 b ismaintained. A consistent and repeatable placement of wires with respectto a mold is ensured during a molding process, thereby preventing wireor jacketed cable damage.

The overmold 110 may be formed to encapsulate at least a substantialportion of the carrier body 105 so that the carrier body 105 is held ina fixed position in relation to the overmold 110. As described above,one or more grooves 440 in the curved outer surface 415 of the wire cap120 may be configured to engage with the cylindrical portion 530. Themolding process forms the overmold 110, filling in the groove 440 andforming a protrusion 540. The cylindrical portion 530 thereby retainsthe wire cap 120 in a fixed axial position along the axis 310.Additionally, the groove 440 provides a reference as to where thecylindrical portion 530 ends along the length L of the wire cap 120. Forexample, the groove 440 may be formed at a length L1, e.g., at amidpoint on the wire cap 120. The protrusion 540 of the overmold 110 maybe formed at the end 535 of the cylindrical portion 530 of the overmold110.

As used herein, references to “an embodiment,” “an implementation,” “anexample,” and/or equivalents is not intended to be interpreted asexcluding the existence of additional embodiments also incorporating therecited features.

The present disclosure is not to be limited in scope by the specificembodiments described herein. Indeed, other various embodiments of andmodifications to the present disclosure, in addition to those describedherein, will be apparent to those of ordinary skill in the art from theforegoing description and accompanying drawings. Thus, such otherembodiments and modifications are intended to fall within the scope ofthe present disclosure. Furthermore, although the present disclosure hasbeen described herein in the context of a particular implementation in aparticular environment for a particular purpose, those of ordinary skillin the art will recognize its usefulness is not limited thereto and thepresent disclosure can be beneficially implemented in any number ofenvironments for any number of purposes. Thus, the claims set forthbelow are to be construed in view of the full breadth and spirit of thepresent disclosure as described herein.

What is claimed is:
 1. A method for forming a wire overmold device, themethod comprising: inserting one or more electronic components and atleast one of a jacketed cable and one or more wires in a carrier body,the carrier body having a distal end and a proximal end; at leastpartially enclosing the at least one of the jacketed cable and the oneor more wires between a wire cap and the carrier body; forming anovermold over the proximal end of the carrier body and at least portionsof the wire cap and the distal end of the carrier body; wherein the wirecap and the distal end of the carrier body protrude from the overmold.2. The method according to claim 1, wherein the carrier body is anelongated semi-cylindrical body having a curved outer surface and a topsurface portion.
 3. The method according to claim 2, wherein one or morecavities are formed in the top surface portion and extend into thesemi-cylindrical body.
 4. The method according to claim 3, wherein afirst cavity formed in the proximal end of the carrier body, the firstcavity being configured to receive an electronic component.
 5. Themethod according to claim 3, wherein a second cavity extends from theproximal end of the carrier body, along the semi-cylindrical body, tothe distal end of the carrier body, the second cavity being configuredto receive a first wire.
 6. The method according to claim 5, wherein athird cavity extends from the proximal end of the carrier body, alongthe semi-cylindrical body, to the distal end of the carrier body, thethird cavity being configured to receive a second wire, wherein thesecond cavity and the third cavity are substantially parallel to eachother.
 7. The method according to claim 2, wherein the wire cap includesa semi-cylindrical body and a top surface portion, the wire cap topsurface portion mating with the carrier body top surface portion toenclose the at least one of the jacketed cable and one or more wires. 8.The method according to claim 1, wherein the wire cap includes aprotrusion, the protrusion being receivable in a corresponding recess inthe distal end of the carrier body such that the one or more wires areat least partially enclosed between the wire cap and the distal end ofthe carrier body.
 9. The method according to claim 8, wherein the wirecap includes a curved outer surface, the curved outer surface having agroove for engaging with the overmold.
 10. The method according to claim1, wherein the overmold is formed over a bushing, the bushing beingadjacent to the carrier body.